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| ◎超微 X7DB3的详细参数 |
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处理器
(Processor) |
双路771-pin LGA 插槽最大支持2个Intel® 64-bit Xeon® 处理器在同样的板子上双核 Intel® Xeon® Processor 5100/5000 sequence (Woodcrest/Dempsey processor) with 2MB L2 Integrated Advanced Transfer Cache per core, 4MB L2 cache total, 可达 3.73 GHz |
| Dual-Core processing |
·Multiplies server performance by doubling processing ability on a single chip, without increasing power consumption. |
| Intel® Virtualization Technology2 |
·Turns a physical server into multiple systems (virtual machines) allowing multiple operating systems and applications to run inside a single platform. |
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系统总线
(System Bus) |
·1333 / 1066 / 667 MHz 系统总线 |
| Dual independent bus architecture |
·Enables dedicated data flow to each processor, maximizing system performance. |
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芯片组
(Chipset) |
Intel® 5000P (Blackford) chipset MCH + PXH + ESB2 |
Super I/O芯片
(Super I/O Chipset) |
• Winbond super I/O W83627HFAW |
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内存尺寸
(Memory Size) |
·512 MB, 1GB, 2GB, 4GB |
内存类型
(Memory Type) |
667 / 533MHz FB-DIMM (Fully Buffered DIMM) ECC DDR2 SDRAM 72-bit, 240-pin gold-plated DIMMs |
内存容量
(Memory Capacity) |
8个240-pin DIMM 插槽 最大支持32 GB 667 / 533MHz DDR2 ECC FB-DIMM 内存 Dual branch 内存总线内存必须成双成对出现支持内存镜像 |
内存电压
(Memory Voltage) |
1.8 V only 1.5V(AMB) |
内存错误侦测
(Error Detection) |
纠正 single-bit错误 监测 double-bit errors (用 ECC 内存) 支持 Intel® x4 and x8 单个设备驱动 修正 (SDDC) |
| Fully buffered DIMM memory |
·Increases capacity and memory bandwidth to keep pace with the processor and I/O performance enhancements. |
| Intel® Extended Memory 64 Technology1 |
Extends the amount of available server memory. | |
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